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Thermal and Mechanical Properties of Epoxy Molding Compound (EMC) for Fan Out Wafer Lever Packages
Thermal and Mechanical Properties of Epoxy Molding Compound (EMC) for Fan Out Wafer Lever Packages
- 제목
- Thermal and Mechanical Properties of Epoxy Molding Compound (EMC) for Fan Out Wafer Lever Packages
- 제목 (타언어)
- Thermal and Mechanical Properties of Epoxy Molding Compound (EMC) for Fan Out Wafer Lever Packages
- 저자
- Yoon, Ho Gyu
- 발행일
- 2018-10-11
- 학회명
- 한국고분자학회
- 개최국가
- 대한민국
- 학회 개최일
- 2018-10-11 ~ 2018-10-12