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Thermal Challenges and Opportunities for Off-the-shelf 3D-stacked CPUs
Thermal Challenges and Opportunities for Off-the-shelf 3D-stacked CPUs
- 제목
- Thermal Challenges and Opportunities for Off-the-shelf 3D-stacked CPUs
- 제목 (타언어)
- Thermal Challenges and Opportunities for Off-the-shelf 3D-stacked CPUs
- 저자
- Sung Woo Chung
- 발행일
- 2025-08-05
- 학회명
- IEEE/ACM International Symposium on Low Power Electronics and Design
- 개최국가
- 아이슬란드
- 학회 개최일
- 2025-08-04 ~ 2025-08-06