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Effect of interfacial compound layer on Pd resettlement during reflow and solid-state reactions between Sn-rich solder and Ni substrate
- 제목
- Effect of interfacial compound layer on Pd resettlement during reflow and solid-state reactions between Sn-rich solder and Ni substrate
- 저자
- Huh, Joo Youl
- 발행일
- 2012-03-13
- 학회명
- TMS2012
- 개최지
- Florida(Orlando)
- 개최국가
- 미국
- 학회 개최일
- 2012-03-11 ~ 2012-03-15