Microstrip Array Antennas Packaged in Metal Fixture for 150 GHz Beamforming Applications

Citations

WEB OF SCIENCE

4
Citations

SCOPUS

5

초록

An innovative array-antenna packaging technique is introduced for D-band beamforming applications. This technique involves a metallic module that houses the antenna array, effectively mitigating radiation losses in antenna feed lines. This method also results in the generation of a radiation beam from the opening at the module edge, facilitating the seamless assembly of a two-dimensional array. Test modules have been constructed, featuring both a single-channel antenna and an eight-channel array antenna, to validate the loss improvements at 150 GHz. The modules for both single and array antenna exhibit similar amounts of insertion losses of 1.5-3 dB within the 110-170 GHz range. Moreover, the main radiation beam of the array module shifts predictably, from 0 degrees to 14 degrees and 28 degrees, with incremental phase delays of 45 degrees and 90 degrees, respectively, applied to the feed lines.

키워드

Antenna feeds; Antenna arrays; Antenna measurements; Metals; Dipole antennas; Antenna radiation patterns; Substrates; Antenna feed lines; beamforming antennas; D-band antennas; printed circuit board (PCB) antennas; WIDE-BAND
제목
Microstrip Array Antennas Packaged in Metal Fixture for 150 GHz Beamforming Applications
저자
Kim, Yang Woo; Koh, Yoon Kyeong; Kim, Moonil
DOI
10.1109/LAWP.2023.3343698
발행일
2024-03
유형
Article
저널명
IEEE Antennas and Wireless Propagation Letters
권
23
호
3
페이지
1055 ~ 1059