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Engineering Hydrogel ECM Component for in vitro 3D Skeletal Muscle-like Bundle
Engineering Hydrogel ECM Component for in vitro 3D Skeletal Muscle-like Bundle
- 제목
- Engineering Hydrogel ECM Component for in vitro 3D Skeletal Muscle-like Bundle
- 제목 (타언어)
- Engineering Hydrogel ECM Component for in vitro 3D Skeletal Muscle-like Bundle
- 저자
- Chung, Seok
- 발행일
- 2018-05-17
- 학회명
- 2018 바이오칩학회 춘계학술대회
- 개최국가
- 대한민국
- 학회 개최일
- 2018-05-16 ~ 2018-05-18