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Glass-to-glass anodic bonding for high vacuum packaging of microelectronics and its stability
- 제목
- Glass-to-glass anodic bonding for high vacuum packaging of microelectronics and its stability
- 저자
- Ju, Byeongkwon
- 학회명
- IEEE MEMS’2000
- 학회 개최일
- 2000-01-23 ~ 2000-01-27