Thermally assisted nanotransfer printing with sub-20-nm resolution and 8-inch wafer scalability

  • Park, Tae Wan
  • Byun, Myunghwan
  • Jung, Hyunsung
  • Lee, Gyu Rac
  • Park, Jae Hong
  • 외 8명
Citations

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초록

Nanotransfer printing (nTP) has attracted considerable attention due to its good pattern resolution, process simplicity, and cost-effectiveness. However, the development of a large-area nTP process has been hampered by critical reliability issues related to the uniform replication and regular transfer printing of functional nanomaterials. Here, we present a very practical thermally assisted nanotransfer printing (T-nTP) process that can easily produce well-ordered nanostructures on an 8-inch wafer via the use of a heat-rolling press system that provides both uniform pressure and heat. We also demonstrate various complex pattern geometries, such as wave, square, nut, zigzag, and elliptical nanostructures, on diverse substrates via T-nTP. Furthermore, we demonstrate how to obtain a high-density crossbar metal-insulator-metal memristive array using a combined method of T-nTP and directed self-assembly. We expect that the state-of-the-art T-nTP process presented here combined with other emerging patterning techniques will be especially useful for the large-area nanofabrication of various devices.

키워드

NANOIMPRINT LITHOGRAPHYFILMSNANOSTRUCTURESNANOPATTERNSPOLYSTYRENEELECTRONICS
제목
Thermally assisted nanotransfer printing with sub-20-nm resolution and 8-inch wafer scalability
저자
Park, Tae WanByun, MyunghwanJung, HyunsungLee, Gyu RacPark, Jae HongJang, Hyun-IkLee, Jung WooKwon, Se HunHong, SeungbumLee, Jong-HeunJung, Yeon SikKim, Kwang HoPark, Woon Ik
DOI
10.1126/sciadv.abb6462
발행일
2020-07
유형
Article
저널명
Science Advances
6
31