상세 보기
Sub-micron patterning on 6-inch wfer using soft-lithography and monomer based thermally curable resin
- 제목
- Sub-micron patterning on 6-inch wfer using soft-lithography and monomer based thermally curable resin
- 저자
- Lee, Heon
- 학회명
- 2005 NNT
- 개최지
- Nara, Japan
- 학회 개최일
- 2005-10-19 ~ 2005-10-21