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Effects of Surface Finishes on the IMC Formation and SOlder Joint Reliability of Memory Module Assembly Using BGA Sn-Ag-Au Solders
- 제목
- Effects of Surface Finishes on the IMC Formation and SOlder Joint Reliability of Memory Module Assembly Using BGA Sn-Ag-Au Solders
- 저자
- Huh, Joo Youl
- 발행일
- 2005-02-14
- 학회명
- The Minerals, Metals & Materials Society
- 개최국가
- 미국
- 학회 개최일
- 2005-02-13 ~ 2005-02-17