상세 보기
Electrical characteristics of atomic layer deposited tungsten nitride diffusion barrier for cu interconnects
- 제목
- Electrical characteristics of atomic layer deposited tungsten nitride diffusion barrier for cu interconnects
- 저자
- Ju, Byeongkwon
- 학회명
- 2010 Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices
- 개최국가
- 일본
- 학회 개최일
- 2010-06-30 ~ 2010-07-02