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Effect of Pd(P) layer on reflow reaction of submicron Au/Pd(P)/Ni(P) surface finish with Sn-Ag-(Cu) solders
Effect of Pd(P) layer on reflow reaction of submicron Au/Pd(P)/Ni(P) surface finish with Sn-Ag-(Cu) solders
- 제목
- Effect of Pd(P) layer on reflow reaction of submicron Au/Pd(P)/Ni(P) surface finish with Sn-Ag-(Cu) solders
- 제목 (타언어)
- Effect of Pd(P) layer on reflow reaction of submicron Au/Pd(P)/Ni(P) surface finish with Sn-Ag-(Cu) solders
- 저자
- Huh, Joo Youl
- 발행일
- 2014-11-18
- 학회명
- 3rd Electronic Materials and Nanotechnology for Green Environment (ENGE 2014)
- 개최지
- 제주
- 개최국가
- 대한민국
- 학회 개최일
- 2014-11-16 ~ 2014-11-19