Lithiophilic Zn on 3D Cu wires for uniform Li plating in Li-metal anodes

초록

Modifying the current collector is an effective strategy for suppressing Li dendrite growth and enabling the practical use of Li-metal anodes. In this study, Zn-coated three-dimensional (3D) Cu wire (denoted as the Zn/Cu wire) was fabricated via a simple electrodeposition process. Combining the lithiophilic nature of Zn and the enlarged surface area provided by the 3D architecture promotes uniform and stable Li nucleation and the formation of a robust solid electrolyte interphase (SEI) layer. The Zn/Cu wire forms an SEI enriched with Li2O, Li2S, and LiF, which are known to exhibit high Li-ion conductivity and excellent interfacial stability. In practice, Zn/Cu wire exhibits low overpotentials and low interfacial resistance, resulting in reversible Li deposition during repeated Li plating/stripping. Asa result, the Zn/Cu wire demonstrated excellent cycling stability, maintaining a high Coulombic efficiency (CE) of 98.5% over 370 cycles at a current density of 1.0 mA cm-2 and a capacity of 1 mAh cm-2 in asymmetric cell tests. In full cell tests using a LiFePO4 cathode, the Zn/Cu wire also exhibited outstanding performance, delivering a discharge capacity of 124.3 mAh g-1 over 100 cycles with a CE of 99.9% at 1 C. (c) 2026 Science Press and Dalian Institute of Chemical Physics, Chinese Academy of Sciences. Published by Elsevier B.V. and Science Press. All rights are reserved, including those for text and data mining, AI training, and similar technologies.

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