A low temperature direct bonding method using an electron-beam evaporated silicon-oxide interlayer

제목
A low temperature direct bonding method using an electron-beam evaporated silicon-oxide interlayer
저자
Ju, Byeongkwon
학회명
MRS 1996 Fall Meeting [MRS Symp.Proc
학회 개최일
1996-12-10 ~ 1996-12-10