Numerical analysis on thermo-fluid-structural performance of graded lattice channels produced by metal additive manufacturing

  • Yun, Sungho
  • Lee, DongChan
  • Jang, Dong Soo
  • Lee, Minwoo
  • Kim, Yongchan
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초록

The graded lattice channel is a novel design for improving heat transfer and structural stability by effectively varying the volume fraction for various applications. However, the combined analysis of the thermo-fluid and structural performances of the graded lattice channel is very limited in the literature. In this study, the thermo-fluid-structural performances of the increase-type graded (IG), V-type graded (VG), and W-type graded (WG) lattice channels were investigated using a thermo-fluid-structural interaction one-way coupled model and compared with that of a uniform lattice channel. The results indicated that the increase-type graded lattice channel had the lowest standard deviation of the working surface temperature owing to an increase in its local convective heat transfer. The V-type lattice channel exhibited the lowest thermo-fluid performance owing to the highest difference in the volume fraction between unit cells. The W-type graded lattice channel exhibited the lowest maximum stress because of its highest support structure. Furthermore, under various inlet velocity and heat flux conditions, the W-type graded lattice channel exhibited superior thermo-fluid-structural performance owing to its high thermo-fluid performance and low stress ratio, when compared with those of other lattice channels. Overall, the graded lattice channels can be recommended as a cooling channel of high-performance electronic devices and manufacturing tools.

키워드

Graded lattice channelThermal performanceStructural performanceMetal additive manufacturingFluid-structural interactionCONVECTION HEAT-TRANSFERMECHANICAL-PROPERTIESPHASE-CHANGEEXCHANGERDESIGNOPTIMIZATIONPARAMETERSPIPESFOAMFIN
제목
Numerical analysis on thermo-fluid-structural performance of graded lattice channels produced by metal additive manufacturing
저자
Yun, SunghoLee, DongChanJang, Dong SooLee, MinwooKim, Yongchan
DOI
10.1016/j.applthermaleng.2021.117024
발행일
2021-07-05
유형
Article
저널명
Applied Thermal Engineering
193