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Numerical Simulation and Thermal Failure Analysis of SOM Package
- 제목
- Numerical Simulation and Thermal Failure Analysis of SOM Package
- 저자
- Ju, Byeongkwon
- 학회명
- 8th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE
- 학회 개최일
- 2007-04-16 ~ 2007-04-18