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Thickness controlled and smooth polycrystalline CVD diamond film deposition on SiO2 with electrostatic self assembly seeding process
- Kim, J. H.;
- Lee, S. K.;
- Kwon, O. M.;
- Hong, S. I.;
- Lim, D. S.
WEB OF SCIENCE
29SCOPUS
31초록
Sub micrometer thick continuous CVD diamond film was synthesized on thermally grown SiO2 film employing the electrostatic self assembly seeding with nano-meter sized ultra dispersed diamond particles. Hot filament CVD system was used to deposit diamond film. Formation of mono-dispersed and mono-layered nano diamond seeding layer by well-known Electrostatic Self-Assembly method was effective to increase density and homogeneity of seeding particles. Because of high density of uniformed seeding particles, the nm controlled continuous CVD films with the surface roughness of less than 13 nm on silicon oxide without any mechanical damage were obtained. Linear growth rate with short incubation time was also observed. Depending on the film thickness, coloring effect was observed ranging from blue to yellow and orange. There was no visible fringe on the coated surface which affirms the good thickness uniformity. (C) 2009 Elsevier B.V. All rights reserved.
키워드
- 제목
- Thickness controlled and smooth polycrystalline CVD diamond film deposition on SiO2 with electrostatic self assembly seeding process
- 저자
- Kim, J. H.; Lee, S. K.; Kwon, O. M.; Hong, S. I.; Lim, D. S.
- 발행일
- 2009-10
- 유형
- Article
- 권
- 18
- 호
- 10
- 페이지
- 1218 ~ 1222