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Effect of structure of biphenyl type epoxy with curing agent and curing condition on suppressing Cu migration
Effect of structure of biphenyl type epoxy with curing agent and curing condition on suppressing Cu migration
- 제목
- Effect of structure of biphenyl type epoxy with curing agent and curing condition on suppressing Cu migration
- 제목 (타언어)
- Effect of structure of biphenyl type epoxy with curing agent and curing condition on suppressing Cu migration
- 저자
- Yoon, Ho Gyu
- 발행일
- 2011-04-08
- 학회명
- 2011년도 춘계 총회 및 학술대회
- 개최지
- 대전
- 개최국가
- 대한민국
- 학회 개최일
- 2011-04-07 ~ 2011-04-08