Full split C-V method for parameter extraction in ultra thin BOX FDSOI MOS devices

  • Shin, Minju; 
  • Shi, Ming; 
  • Mouis, Mireille; 
  • Cros, Antoine; 
  • Josse, Emmanuel; 
  • ... Kim, Gyu-Tae; 
  • 외 1명
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초록

The feasibility of full split C-V method in ultra-thin body and BOX (UTBB) FDSOI devices is demonstrated, emphasizing the usefulness of gate-to-bulk capacitance. The split C-V measurements carried out on both gate-to-channel and gate-to-bulk mode are shown to be consistent with TCAD simulation. This enabled us to propose an improved parameter extraction methodology for the whole vertical FDSOI stack from gate to substrate using back biasing effect. (C) 2014 Elsevier Ltd. All rights reserved.

키워드

SOI; Split CV; UTBB; MOS; MOSFETS
제목
Full split C-V method for parameter extraction in ultra thin BOX FDSOI MOS devices
저자
Shin, Minju; Shi, Ming; Mouis, Mireille; Cros, Antoine; Josse, Emmanuel; Kim, Gyu-Tae; Ghibaudo, Gerard
DOI
10.1016/j.sse.2014.04.039
발행일
2014-09
유형
Article
저널명
Solid-State Electronics
권
99
페이지
104 ~ 107