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New packaging method of field emission display using silicon-to-ITO coated glass bonding
- 제목
- New packaging method of field emission display using silicon-to-ITO coated glass bonding
- 저자
- Ju, Byeongkwon
- 학회명
- Proc.IVMC’97
- 학회 개최일
- 1997-08-10 ~ 1997-08-10