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Effect of Cu-contained solders on shear strength of BGA solder joints
- 제목
- Effect of Cu-contained solders on shear strength of BGA solder joints
- 저자
- Huh, Joo Youl
- 발행일
- 2000-04-24
- 학회명
- Symp. on Micrelec. and Packaging, IMAPS-korea and IEEE-CMPT
- 개최지
- Symp. on Micrelec. and Packaging, IMAPS-korea and IEEE-CMPT
- 개최국가
- 미국
- 학회 개최일
- 2000-04-23 ~ 2000-04-27