ScholarWorks@고려대학교

상세 보기

High filler loading and its effect on the reliability of epoxy molding compound

제목
High filler loading and its effect on the reliability of epoxy molding compound
저자
Yoon, Ho Gyu
학회명
Proceedings of 2nd Electrinics Packaging Technology Conference
개최지
Proceedings of 2nd Electrinics Packaging Technology Conference
학회 개최일
1998-12-10

ScholarWorks@고려대학교

02841 서울특별시 성북구 안암로 145 Tel. 02-3290-2963

COPYRIGHT © 고려대학교 All Rights Reserved.

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.

You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.