Quality factor measurement of micro gyroscope structure according to vacuum level and desired Q-factor range package method

  • Kim, Jong-Seok
  • Lee, Sang-Woo
  • Jung, Kyu-Dong
  • Kim, Woon-Bae
  • Choa, Sung-Hoon
  • ... Ju, Byeong-Kwon
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초록

A micro-machined gyro chip of gyroscope is normally packaged in specific vacuum level to get the specific quality factor(Q-factor). if the Q-factor is too high, frequency tuning and the approximate matching between driving and sensing comb structure become difficult, and if the Q-factor is too low, its sensitivity decreases. The optimum Q-factor of our gyro chip design is 4000 range. To get this range, we measured the drive mode Q-factor as vacuum level of our gyro chip and we found that the vacuum level of the desired Q-factor 4000 is in the range of 740 mTorr. Based on this data, we fabricate the wafer level package gyro chip of the desired Q-factor by controlled the basic pressure of package bonding chamber just prior to the bonding process. After wafer level package process, we measured Q-factor of whole samples. Among 804 samples, 502 packaged gyro chips are worked and the Q-factor of 67% samples is between 3500 and 4500 range. (c) 2008 Elsevier Ltd. All rights reserved.

키워드

RF-MEMSGyroscopeQuality factor
제목
Quality factor measurement of micro gyroscope structure according to vacuum level and desired Q-factor range package method
저자
Kim, Jong-SeokLee, Sang-WooJung, Kyu-DongKim, Woon-BaeChoa, Sung-HoonJu, Byeong-Kwon
DOI
10.1016/j.microrel.2008.03.001
발행일
2008-06
유형
Article
저널명
Microelectronics and Reliability
48
6
페이지
948 ~ 952