Auxeticity-by-Assembly: Interlocking Modular Auxetic Metamaterials with Selectively Activatable AgNW-Graphene Oxide-EGaIn Composite Interconnects for Scalable Freeform Photovoltaic Modules

초록

Standardization remains a key bottleneck for scaling freeform photovoltaics beyond bespoke, cut-defined layouts, particularly when electrical interconnection must survive repeated deformation at joint hotspots. Here we introduce Auxeticity-by-Assembly-an interlocking modular auxetic metamaterial that generates reconfigurable freeform photovoltaic (PV) modules by repeating a standardized interlocking unit and choosing the assembly topology. The unit integrates rigid tiles for device mounting with compliant hinges and locking hinge joints, and incorporates a folding-enabled interconnector that routes current from perovskite mini-modules to hinge interconnect regions while mitigating strain at contacts. To wire the mechanically active joints, we develop selectively activatable AgNW-GO-EGaIn composite interconnects that combine partially embedded Ag nanowires for adhesion with graphene oxide-coated EGaIn liquid-metal particles (GO@EGaIn LMPs) for mechanically or laser-rupture-activated conduction. The interconnects enable on-demand patterning and maintain conductivity under folding and large tensile deformation. A 5 & times; 5 perovskite platform reaches a decimeter-scale footprint (similar to 900 cm(2)), conformally deploys on dome-like surfaces, and preserves photovoltaic I-V characteristics over repeated expansion-contraction cycles. Auxeticity-by-Assembly provides a scalable, standardized route to deployable freeform PV and other reconfigurable electronic skins.

키워드