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A study of Ag sintering bonding on Cu substrate with various surface treatment
A study of Ag sintering bonding on Cu substrate with various surface treatment
- 제목
- A study of Ag sintering bonding on Cu substrate with various surface treatment
- 제목 (타언어)
- A study of Ag sintering bonding on Cu substrate with various surface treatment
- 저자
- BYUN, Dong Jin
- 발행일
- 2023-10-26
- 학회명
- 2023년도 International Symposium on Microelectronics and Packaging
- 개최국가
- 대한민국
- 학회 개최일
- 2023-10-25 ~ 2023-10-27