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Modified low-temperature direct bonding method for vacuum microelectronics application
- 제목
- Modified low-temperature direct bonding method for vacuum microelectronics application
- 저자
- Ju, Byeongkwon
- 학회명
- SPIE’s 4th Annual Symposium on Smart Structures and Materials
- 학회 개최일
- 1997-03-10 ~ 1997-03-10