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Adhesion properties and residual stress of polyimide/Cu laminates for flexible printed circuits
- 제목
- Adhesion properties and residual stress of polyimide/Cu laminates for flexible printed circuits
- 저자
- Yoon, Ho Gyu
- 학회명
- IUPAC International Symposiumon Advanced Polymers for Emerging Technologies
- 개최지
- Busan, Korea
- 학회 개최일
- 2006-10-10 ~ 2006-10-13