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Effects of Cu, Sn, and Mn Additions on Intermetallic Layer Growth in Hot-Dip Aluminizing with Al-9Si Bath
Effects of Cu, Sn, and Mn Additions on Intermetallic Layer Growth in Hot-Dip Aluminizing with Al-9Si Bath
- 제목
- Effects of Cu, Sn, and Mn Additions on Intermetallic Layer Growth in Hot-Dip Aluminizing with Al-9Si Bath
- 제목 (타언어)
- Effects of Cu, Sn, and Mn Additions on Intermetallic Layer Growth in Hot-Dip Aluminizing with Al-9Si Bath
- 저자
- Huh, Joo Youl
- 발행일
- 2025-09-29
- 학회명
- MS&T25
- 개최지
- Greater Columbus Convention Center
- 개최국가
- 미국
- 학회 개최일
- 2025-09-28 ~ 2025-10-01