ScholarWorks@Korea University: Chung, Sung Woo

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Chung, Sung Woo (정성우)

Graduate School (Department of Computer Science and Engineering)

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Tel 02-3290-3194
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microprocessor:4||process variation:3||Thermal management:3||Cache:3||energy efficiency:3||Random access memory:2||dynamic thermal management:2||performance counter:2||instruction cache:2||DVFS:2||energy management:2||3D integration:2||Temperatureaware Microprocessor:2||embedded systems:2||Compression:2||mobile device:2||Accelerator:2||yield:2||power management:2||performance:2||SSD (SolidState Disk):2||동적 온도 제어:2||Performance:2||Energy consumption:2||Temperature:2||smartphone:2||온도 인지 마이크로프로세서:2||power model:2||reliability:2||leakage:2||Microprocessor:2||liquid cooling:2||Dynamic thermal management (DTM):2||Dynamic Thermal Management:2||GPU:2||lowpower scheme:1||narrowwidth value:1||Processor architecture:1||Management:1||Low Power:1||컴퓨터 성능:1||Solid state disk (SSD):1||메모리:1||North Bridge:1||Hotspot compact model:1||Simulation:1||banked register file:1||Thermal Management:1||layerwise quantization:1||storage method:1||thermal feasibility:1||Quantized neural networks:1||Precision scalable computation:1||Memory management:1||Multiplyaccumulate:1||Offloading:1||preprocessing:1||wireless signal strength:1||task scheduler:1||eDRAM:1||3D Microprocessors:1||DRAM refresh:1||main memory:1||Dynamic thermal management:1||leakage power:1||Multicore:1||thermal management:1||architectural investigation:1||selective wordline voltage boosting:1||CUDA:1||Highperformance Computing:1||Online Power Estimation:1||Contextaware computing:1||Computer Performance:1||Power Management:1||Performance emulator:1||thermal sensor:1||성능 계수기:1||CPU 오버클럭킹(CPU Overclocking):1||TLM (Transaction Level Modeling):1||성능 (Performance):1||컴파일러 최적화 (Compiler optimization):1||레지스터 파일:1||High performance:1||Energy harvesting:1||Thermoelectric:1||dynamic frequency scaling:1||monolithic 3D integration:1||Hardware:1||ASIC:1||Data communication:1||image processing:1||Cooperative data transfer:1||Thermal Modeling:1||Multimedia application:1||ambient temperature:1||performance and reliability:1||Green computing:1||동영상 재생기:1||System performance:1||Operating system:1||microprocessors:1||Memory:1||multicore research:1||핫스팟 모델:1||무선센서 네트워크:1||soft error:1||branch predictor:1||wakeup policy:1||Migration:1||DVFS (Dynamic Voltage and Frequency Scaling):1||monolithic 3D:1||scratchpad memory (SPM):1||quantized neural network (QNN):1||cooling solution:1||Digital based computing in memory:1||Error correction codes:1||DRAM reliability:1||error correction code:1||Quantization (signal):1||embedding table:1||nearmemory processing:1||embedded system:1||Performance evaluation:1||Stream operation:1||Direct memory access:1||Energy management:1||PackageonPackage:1||smart device:1||Embedded dynamic random access Memory:1||Energyefficiency:1||refresh interval:1||dynamic voltage frequency scaling:1||Overclocking:1||Laptop energy consumption:1||Media Player:1||전력 관리:1||User Proficiency:1||User Satisfaction:1||Cache memories:1||Replacement Algorithm:1||architecture:1||DRAM interface:1||모델링:1||응답지연시간:1||page allocation:1||neural network:1||cache:1||power:1||temperature:1||Data reorganization:1||Cooling:1||onchip temperature:1||Codes:1||Error correction:1||heterogeneous multicore processor:1||Memory latency:1||Warp scheduling:1||Image processing:1||Wireless communication:1||Mobile Application Processor:1||heterogeneous mobile multicore processor:1||leakage energy optimization:1||power consumption:1||dynamic voltage and frequency scaling:1||mobile:1||Smartphone energy savings:1||lowpower design:1||Smartphone:1||Display power management:1||task assignment:1||Direct memory access (DMA):1||malicious codes:1||NAND flash:1||Temperature Simulation:1||온도 시뮬레이션:1||시뮬레이션:1||Throughput:1||Wireless sensor networks:1||패킷손실 확률:1||성능 향상(Performance Improvement):1||Systemonchip:1||data compression:1||personalized recommendation model:1||M3D stacking:1||TSVBased 3D stacking:1||migration:1||Servers:1||operating systems:1||Refresh:1||Refresh interval:1||3D microprocessor:1||lastlevel cache:1||CPU:1||Scheduling:1||사용자 숙련도:1||사용자 만족:1||temperaturedependent leakage power:1||finegrain localized hotspot:1||캐시:1||OS systems:1||Computer Architecture:1||Packet loss probability:1||압축:1||Demand paging:1||eXecuteInPlace (XIP):1||DTM:1||drowsy technique:1||VM (Virtual Machine):1||Mobile devices:1||Delays:1||binary neural network:1||GPGPU:1||Utilization:1||Lastlevel cache:1||battery consumption:1||early wakeup:1||supply voltage lowering:1||모바일 기기:1||저전력:1||Mobile Device:1||realtime systems:1||thermal attack:1||마이크로프로세서:1||Latency:1||처리량:1||에너지 효율(Energy Efficiency):1||flash memory:1||page replacement:1||computer architecture:1||Architecture exploration:1||matrix multiplication:1||Threedimensional displays:1||Data compression:1||DRAM chips:1||Data transfer:1||Table lookup:1||Mobile handsets:1||Heterogeneous computing:1||power breakdown:1||drowsy cache:1||microarchitectural thermal simulation:1||Design:1||Power Behavior:1||Distributed architectures:1||load balancing:1||heat sink:1||교체 정책:1||컴퓨터 구조:1||Modeling:1||OneNAND:1||lowpower:1||NAND Flash:1||컴퓨터 구조 (Computer Architecture):1||파워 효율성 (Power efficiency):1||Register File:1||Heterogeneous Data Center:1||area:1||processinginmemory (PIM):1||instorage accelerator:1||multidimensional database:1||Energy efficiency:1||Microprocessors:1||Clocks:1||Monolithic 3D integration:1||neural processing unit:1||computeinmemory:1||Reliability:1||Retirement:1||inference:1||

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