Improved resistive-switching characteristics observed in Pt embedded nickel-nitride films prepared by radio-frequency magnetron sputtering
DC Field | Value | Language |
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dc.contributor.author | Yun, Min Ju | - |
dc.contributor.author | Kim, Hee-Dong | - |
dc.contributor.author | Kim, Tae Geun | - |
dc.date.accessioned | 2021-09-05T19:30:23Z | - |
dc.date.available | 2021-09-05T19:30:23Z | - |
dc.date.created | 2021-06-15 | - |
dc.date.issued | 2013-11 | - |
dc.identifier.issn | 1071-1023 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/101679 | - |
dc.description.abstract | In this paper, the authors report the forming-free bipolar-switching operation at low set/reset voltages (V-SET/V-RESET) using a Pt embedded-NiN based resistive random access memory (ReRAM) cell. Compared to conventional NiN based ReRAM cells, the variations in V-SET and V-RESET were reduced from 1 to 0.4V and from 0.4 to 0.2 V, respectively, using the Pt embedded ReRAM cells. These results show that the embedded Pt particles might assist in the uniform formation of the conducting filaments in the NiN films, without an initial forming process. In addition, in the endurance and retention tests, Pt embedded ReRAM cells showed more stable repetitive dc cycling characteristics with a larger resistance ratio of approximately 1 x 10(1) and a longer data retention of over 10(5) s. (C) 2013 American Vacuum Society. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | A V S AMER INST PHYSICS | - |
dc.subject | TIO2 THIN-FILMS | - |
dc.subject | DEVICES | - |
dc.subject | MEMORY | - |
dc.subject | RRAM | - |
dc.subject | NANOCRYSTALS | - |
dc.subject | MECHANISM | - |
dc.title | Improved resistive-switching characteristics observed in Pt embedded nickel-nitride films prepared by radio-frequency magnetron sputtering | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, Tae Geun | - |
dc.identifier.doi | 10.1116/1.4824488 | - |
dc.identifier.scopusid | 2-s2.0-84890021532 | - |
dc.identifier.wosid | 000327708300060 | - |
dc.identifier.bibliographicCitation | JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, v.31, no.6 | - |
dc.relation.isPartOf | JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | - |
dc.citation.title | JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | - |
dc.citation.volume | 31 | - |
dc.citation.number | 6 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | TIO2 THIN-FILMS | - |
dc.subject.keywordPlus | DEVICES | - |
dc.subject.keywordPlus | MEMORY | - |
dc.subject.keywordPlus | RRAM | - |
dc.subject.keywordPlus | NANOCRYSTALS | - |
dc.subject.keywordPlus | MECHANISM | - |
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