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Hybrid Bulk Acoustic Wave Structure for Temperature Stability in LTE Applications

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dc.contributor.authorShin, Jea-Shik-
dc.contributor.authorSong, Insang-
dc.contributor.authorKim, Chul-Soo-
dc.contributor.authorSon, Sang Uk-
dc.contributor.authorLee, Moon-Chul-
dc.contributor.authorKim, Duck-Hwan-
dc.contributor.authorPark, Ho-Soo-
dc.contributor.authorCui, Jing-
dc.contributor.authorAi, Yujie-
dc.contributor.authorHwang, Sungwoo-
dc.contributor.authorRieh, Jae-Sung-
dc.date.accessioned2021-09-05T22:03:47Z-
dc.date.available2021-09-05T22:03:47Z-
dc.date.created2021-06-14-
dc.date.issued2013-09-
dc.identifier.issn1531-1309-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/102250-
dc.description.abstractA novel structure of hybrid bulk acoustic wave (BAW) resonator with low temperature coefficient of frequency (TCF) is presented. Implemented with a pair of quarter-wave reflectors on air-cavity reflector, the hybrid BAW resonator exhibits a TCF of as low as -11.5ppm/degrees C and an effective electro-mechanical coupling coefficient (kt(2))of 5.1% at the frequency of 2.5 GHz. The hybrid BAW resonator also shows excellent Q-factors of 1627 and 1842 at resonance and anti-resonance frequency, respectively. RF duplexer configured with the hybrid BAW resonators is provided as well. The fabricated RF duplexer for long term evolution (LTE) band-7, which should be designed to prevent the co-existence problem with WiFi having extremely narrow fractional band-gap of 0.7%, achieves an attenuation of 36.8 dB and an insertion loss of 2.4 dB.-
dc.languageEnglish-
dc.language.isoen-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.titleHybrid Bulk Acoustic Wave Structure for Temperature Stability in LTE Applications-
dc.typeArticle-
dc.contributor.affiliatedAuthorRieh, Jae-Sung-
dc.identifier.doi10.1109/LMWC.2013.2272609-
dc.identifier.scopusid2-s2.0-84883764020-
dc.identifier.wosid000324250700004-
dc.identifier.bibliographicCitationIEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.23, no.9, pp.453 - 455-
dc.relation.isPartOfIEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS-
dc.citation.titleIEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS-
dc.citation.volume23-
dc.citation.number9-
dc.citation.startPage453-
dc.citation.endPage455-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.subject.keywordAuthorBulk acoustic wave (BAW) resonator-
dc.subject.keywordAuthorRF duplexer-
dc.subject.keywordAuthorRF filter-
dc.subject.keywordAuthortemperature coefficient of frequency (TCF)-
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