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Etch pit investigation of free electron concentration controlled 4H-SiC

Authors
Kim, Hong-YeolShin, Yun JiKim, Jung GonHarima, HiroshiKim, JihyunBahng, Wook
Issue Date
15-Apr-2013
Publisher
ELSEVIER SCIENCE BV
Keywords
Characterization; Doping; Etching; Line defects; Semiconducting materials
Citation
JOURNAL OF CRYSTAL GROWTH, v.369, pp.38 - 42
Indexed
SCIE
SCOPUS
Journal Title
JOURNAL OF CRYSTAL GROWTH
Volume
369
Start Page
38
End Page
42
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/103506
DOI
10.1016/j.jcrysgro.2013.01.047
ISSN
0022-0248
Abstract
Etch pits were investigated using the molten KOH selective etching method to examine dependence of etch pit shape and size on free electron concentration. The free electron concentrations of highly doped 4H-silicon carbide (SiC) were controlled by proton irradiation and thermal annealing, which was confirmed by a frequency shift in the LO-phonon-plasmon-coupled (LOPC) mode on micro-Raman spectroscopy. The proton irradiated sample with 5x10(15) cm(-2) fluence and an intrinsic semi-insulating sample showed clearly classified etch pits but different ratios of threading screw dislocation (TSD) and threading edge dislocation (TED) sizes. Easily classified TEDs and TSDs on proton irradiated 4H-SiC were restored as highly doped 4H-SiC after thermal annealing due to the recovered carrier concentrations. The etched surface of proton irradiated 4H-SiC and boron implanted SiC showed different surface conditions after activation. (C) 2013 Elsevier B.V. All rights reserved.
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