Soldering-based easy packaging of thin polyimide multichannel electrodes for neuro-signal recording
- Authors
- Baek, Dong-Hyun; Han, Chang-Hee; Jung, Ha-Chul; Kim, Seon Min; Im, Chang-Hwan; Oh, Hyun-Jik; Pak, James Jungho; Lee, Sang-Hoon
- Issue Date
- 11월-2012
- Publisher
- IOP PUBLISHING LTD
- Citation
- JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.22, no.11
- Indexed
- SCIE
SCOPUS
- Journal Title
- JOURNAL OF MICROMECHANICS AND MICROENGINEERING
- Volume
- 22
- Number
- 11
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/107090
- DOI
- 10.1088/0960-1317/22/11/115017
- ISSN
- 0960-1317
- Abstract
- We propose a novel packaging method for preparing thin polyimide (PI) multichannel microelectrodes. The electrodes were connected simply by making a via-hole at the interconnection pad of a thin PI electrode, and a nickel (Ni) ring was constructed by electroplating through the via-hole to permit stable soldering with strong adhesion to the electrode and the printed circuit board. The electroplating conditions were optimized for the construction of a well-organized Ni ring. The electrical properties of the packaged electrode were evaluated by fabricating and packaging a 40-channel thin PI electrode. Animal experiments were performed using the packaged electrode for high-resolution recording of somatosensory evoked potential from the skull of a rat. The in vivo and in vitro tests demonstrated that the packaged PI electrode may be used broadly for the continuous measurement of bio-signals or for neural prosthetics.
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