Silicon-based metallic micro grid for electron field emission
DC Field | Value | Language |
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dc.contributor.author | Kim, Jaehong | - |
dc.contributor.author | Jeon, Seok-Gy | - |
dc.contributor.author | Kim, Jung-Il | - |
dc.contributor.author | Kim, Geun-Ju | - |
dc.contributor.author | Heo, Duchang | - |
dc.contributor.author | Shin, Dong Hoon | - |
dc.contributor.author | Sun, Yuning | - |
dc.contributor.author | Lee, Cheol Jin | - |
dc.date.accessioned | 2021-09-06T14:46:27Z | - |
dc.date.available | 2021-09-06T14:46:27Z | - |
dc.date.created | 2021-06-15 | - |
dc.date.issued | 2012-10 | - |
dc.identifier.issn | 0960-1317 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/107256 | - |
dc.description.abstract | A micro-scale metal grid based on a silicon frame for application to electron field emission devices is introduced and experimentally demonstrated. A silicon lattice containing aperture holes with an area of 80 x 80 mu m(2) and a thickness of 10 mu m is precisely manufactured by dry etching the silicon on one side of a double-polished silicon wafer and by wet etching the opposite side. Because a silicon lattice is more rigid than a pure metal lattice, a thin layer of Au/Ti deposited on the silicon lattice for voltage application can be more resistant to the geometric stress caused by the applied electric field. The micro-fabrication process, the images of the fabricated grid with 88% geometric transparency and the surface profile measurement after thermal feasibility testing up to 700 degrees C are presented. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | IOP PUBLISHING LTD | - |
dc.subject | SIMULATION | - |
dc.subject | MEMBRANE | - |
dc.subject | BEAM | - |
dc.title | Silicon-based metallic micro grid for electron field emission | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Shin, Dong Hoon | - |
dc.contributor.affiliatedAuthor | Lee, Cheol Jin | - |
dc.identifier.doi | 10.1088/0960-1317/22/10/105009 | - |
dc.identifier.scopusid | 2-s2.0-84866461338 | - |
dc.identifier.wosid | 000309219500009 | - |
dc.identifier.bibliographicCitation | JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.22, no.10 | - |
dc.relation.isPartOf | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
dc.citation.title | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
dc.citation.volume | 22 | - |
dc.citation.number | 10 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Instruments & Instrumentation | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Instruments & Instrumentation | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | SIMULATION | - |
dc.subject.keywordPlus | MEMBRANE | - |
dc.subject.keywordPlus | BEAM | - |
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