Metal/Dielectric Liner Formation by a Simple Solution Process for through Silicon via Interconnection
DC Field | Value | Language |
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dc.contributor.author | Ham, Yong-Hyun | - |
dc.contributor.author | Kim, Dong-Pyo | - |
dc.contributor.author | Baek, Kyu-Ha | - |
dc.contributor.author | Park, Kun-Sik | - |
dc.contributor.author | Kim, Moonkeun | - |
dc.contributor.author | Kwon, Kwang-Ho | - |
dc.contributor.author | Lee, Kijun | - |
dc.contributor.author | Do, Lee-Mi | - |
dc.date.accessioned | 2021-09-07T00:06:51Z | - |
dc.date.available | 2021-09-07T00:06:51Z | - |
dc.date.created | 2021-06-18 | - |
dc.date.issued | 2012 | - |
dc.identifier.issn | 1099-0062 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/109392 | - |
dc.description.abstract | We investigated the formation of metal and dielectric liners in via holes. We obtained a conformal deposition of the Ag metal and PVPh liners in Si deep via holes. The measured Ag liner thickness increased from 0.18 mu m to 1.44 mu m as the radius of the via hole was increased from 0.85 mu m to 5 mu m. We also obtained a conformal deposition of the PVPh dielectric liner of about 830 nm in thickness in 10 mu m deep via holes. The Ag metal and PVPh dielectric liners had uniform thickness on every region of their respective deep via holes. (C) 2012 The Electrochemical Society. [DOI: 10.1149/2.esl113678] All rights reserved. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | ELECTROCHEMICAL SOC INC | - |
dc.subject | COPPER | - |
dc.title | Metal/Dielectric Liner Formation by a Simple Solution Process for through Silicon via Interconnection | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kwon, Kwang-Ho | - |
dc.identifier.doi | 10.1149/2.esl113678 | - |
dc.identifier.scopusid | 2-s2.0-84860185964 | - |
dc.identifier.wosid | 000301656700019 | - |
dc.identifier.bibliographicCitation | ELECTROCHEMICAL AND SOLID STATE LETTERS, v.15, no.5, pp.H145 - H147 | - |
dc.relation.isPartOf | ELECTROCHEMICAL AND SOLID STATE LETTERS | - |
dc.citation.title | ELECTROCHEMICAL AND SOLID STATE LETTERS | - |
dc.citation.volume | 15 | - |
dc.citation.number | 5 | - |
dc.citation.startPage | H145 | - |
dc.citation.endPage | H147 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Electrochemistry | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Electrochemistry | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.subject.keywordPlus | COPPER | - |
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