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Effect of Pt and Ti on Ni/Ag/(Pt or Ti)/Au p-ohmic contacts of GaN based flip-chip LEDs
- Authors
- Song, Hong Joo; Roh, Cheong Hyun; Choi, Hong Goo; Ha, Min-Woo; Hahn, Cheol-Koo; Park, Jung Ho; Lee, Jun Ho
- Issue Date
- 1-Jul-2011
- Publisher
- ELSEVIER SCIENCE BV
- Keywords
- p-Ohmic contact; Silver (Ag); Specific contact resistivity; Reflectance; Surface morphology; GaN Flip-chip (FC)
- Citation
- APPLIED SURFACE SCIENCE, v.257, no.18, pp.8102 - 8105
- Indexed
- SCIE
SCOPUS
- Journal Title
- APPLIED SURFACE SCIENCE
- Volume
- 257
- Number
- 18
- Start Page
- 8102
- End Page
- 8105
- ISSN
- 0169-4332
- Abstract
- In this paper, we report the dependence of Ni/Ag/diffusion barrier (D.B)/Au p-ohmic contact on Pt-D.B and Ti-D.B for GaN based flip-chip light emitting diodes (FC LEDs). It is shown that D. B metals have strongly influenced on the reflectance and contact resistivity of contacts. We present these results are caused by the variation of the morphology and atomic distribution due to D.Bs. The roles of Pt-D.B and Ti-D.B on Ni/Ag/D.B/Au p-GaN ohmic contacts are analyzed using the confocal laser scanning microscopy (CLSM) measurement and the secondary ion mass spectroscopy (SIMS) profiles in details. (C) 2011 Elsevier B.V. All rights reserved.
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