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Intelligent adaptive process control using dynamic deadband for semiconductor manufacturing

Authors
Ko, Hyo-HeonKim, Jun-SeokKim, JihyunBaek, Jun-GeolKim, Sung-Shick
Issue Date
6월-2011
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Keywords
Semiconductor fabrication process; Photolithography; Process control; Run-to-run; EWMA; Deadband
Citation
EXPERT SYSTEMS WITH APPLICATIONS, v.38, no.6, pp.6759 - 6767
Indexed
SCIE
SCOPUS
Journal Title
EXPERT SYSTEMS WITH APPLICATIONS
Volume
38
Number
6
Start Page
6759
End Page
6767
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/112268
DOI
10.1016/j.eswa.2010.12.073
ISSN
0957-4174
Abstract
This paper proposes an efficient control method to minimize process error and to reduce process variance in semiconductor manufacturing. The photolithography (photo) process forms a complex semiconductor circuit and is important for quality. Obstacles to the process include the facility itself, vibration, wear and tear, product/process changes and environmental influences. Control methodologies being currently used to address these issues often amplify the variation of the process by failing to perform adequate process control. Therefore, this paper proposes an effective process control method to reduce process variance by quickly detecting and identifying process disturbances and accurately reflecting the degree of change to process control. This study proposes dynamic deadband control that uses a region (band) to detect the status of a process change. It adjusts the process control based on the changes detected. In this research, the semiconductor manufacturing company is supported to perform control that is more precise and reduces fluctuations by producing products of uniform quality. In addition, it can contribute to yield due to the quality incentive and increased process control of semiconductor manufacturing. (C) 2010 Elsevier Ltd. All rights reserved.
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공과대학 (산업경영공학부)
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