Virtual drop test methodology for a MEMS-based sensor

Abstract

Virtual drop test methodology based on a set of simulations is developed to evaluate the shock reliability of a MEMS (Micro Electro Mechanical System)-based sensor. The methodology consists of (1) FEM (Finite Element Method) analyses to extract the equivalent parameters of the packaged sensor, (2) a high-level simulation to determine the overall responses caused by an impact on a rigid concrete floor, and (3) another FEM simulation to evaluate whether or not the device withstands the shock by comparing the maximum stress level to the yield strengths of the materials that comprise the device. The proposed methodology accounts for the dynamic shock response as well as the stress distribution in the microstructure encapsulated by the package and thus provide insight into methods of improving the design of the device. Hence, it is expected that the proposed methodology will contribute to the effective development of robust MEMS-based sensors and their successful commercialization.