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Spline regression based feature extraction for semiconductor process fault detection using support vector machine

Authors
Park, JonghyuckKwon, Ick-HyunKim, Sung-ShickBaek, Jun-Geol
Issue Date
5월-2011
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Keywords
Fault detection; Feature extraction; Spline regression; Support vector machine; Semiconductor manufacturing
Citation
EXPERT SYSTEMS WITH APPLICATIONS, v.38, no.5, pp.5711 - 5718
Indexed
SCIE
SCOPUS
Journal Title
EXPERT SYSTEMS WITH APPLICATIONS
Volume
38
Number
5
Start Page
5711
End Page
5718
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/112592
DOI
10.1016/j.eswa.2010.10.062
ISSN
0957-4174
Abstract
Quality control is attracting more attention in semiconductor market due to harsh competition. This paper considers Fault Detection (FD), a well-known philosophy in quality control. Conventional methods, such as non-stationary SPC chart, PCA, PLS, and Hotelling's T-2, are widely used to detect faults. However, even for identical processes, the process time differs. Missing data may hinder fault detection. Artificial intelligence (Al) techniques are used to deal with these problems. In this paper, a new fault detection method using spline regression and Support Vector Machine (SVM) is proposed. For a given process signal, spline regression is applied regarding step changing points as knot points. The coefficients multiplied to the basis of the spline function are considered as the features for the signal. SVM uses those extracted features as input variables to construct the classifier for fault detection. Numerical experiments are conducted in the case of artificial data that replicates semiconductor manufacturing signals to evaluate the performance of the proposed method. (C) 2010 Elsevier Ltd. All rights reserved.
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공과대학 (산업경영공학부)
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