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Resistive Switching Characteristics and Failure Analysis of TiO2 Thin Film Deposited by RF Magnetron Sputtering System

Authors
Jung, Ho YongOh, Sang ChulLee, Heon
Issue Date
2011
Publisher
ELECTROCHEMICAL SOC INC
Citation
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.158, no.2, pp.H178 - H182
Indexed
SCIE
SCOPUS
Journal Title
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Volume
158
Number
2
Start Page
H178
End Page
H182
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/114919
DOI
10.1149/1.3526316
ISSN
0013-4651
Abstract
The effect of the postannealing conditions of TiO2 thin films deposited using a radio frequency (rf) magnetron sputtering system on their electrical resistive switching characteristics was evaluated in the Pt/TiO2/Pt structure, and the compositional change of the TiO2 thin films after resistive switching failure was investigated. The Pt/TiO2/Pt structure with polycrystalline TiO2 showed a relatively more stable set/reset voltage dispersion and resistance difference between the high resistance state (HRS) and low resistance state (LRS) than those with amorphous TiO2. In the energy dispersive X-ray spectroscopy analysis of the TiO2 thin film in Pt/TiO2/Pt with reset-stuck failure, in which the resistive switching from the HRS to the LRS failed after repeated resistive switching, the peak intensity of oxygen was significantly decreased compared with that before resistive switching and the decrease of the oxygen content was more noticeable near the top electrode than near the bottom electrode. Consequently, it is considered that the depletion of oxygen in the TiO2 thin film after multiple resistive switching cycles by successive voltage sweeping could be one of the main causes of the resistive switching failure phenomenon. (C) 2010 The Electrochemical Society. [DOI: 10.1149/1.3526316] All rights reserved.
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공과대학 (신소재공학부)
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