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Solder bump creation by using droplet microgripper for electronic packaging
- Authors
- Lee, S. -Y.; Chang, J. -H.; Kim, D.; Ju, B. K.; Pak, J. J.
- Issue Date
- 16-Sep-2010
- Publisher
- INST ENGINEERING TECHNOLOGY-IET
- Keywords
- Surface treatment; . Solder bump; self-arrangement; droplet microgripper; electronic packaging
- Citation
- ELECTRONICS LETTERS, v.46, no.19, pp.1336 - 1338
- Indexed
- SCIE
SCOPUS
- Journal Title
- ELECTRONICS LETTERS
- Volume
- 46
- Number
- 19
- Start Page
- 1336
- End Page
- 1338
- ISSN
- 0013-5194
- Abstract
- A simple and effective method to create solder bumps by using a droplet microgripper for electronic packaging is described. A reusable droplet microgripper was realised simply by patterning a Teflon amorphous fluoropolymer on a glass substrate to make a 5 x 5 hydrophilic opening site array of 300 mu m-diameter circles and 600 mu m pitches. The microgripper was used to self-arrange solder balls of 300 mu m diameter on its wetted sites. After transferring the solder balls to a flux-coated soldering substrate by an alignment process, solder bumps were successfully created on the corresponding solder ball lands through a reflow process.
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Collections - College of Engineering > School of Electrical Engineering > 1. Journal Articles
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Related Researcher
- Ju, Byeong kwon
- College of Engineering (School of Electrical Engineering)