Surface characteristics of parylene-C films in an inductively coupled O-2/CF4 gas plasma
DC Field | Value | Language |
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dc.contributor.author | Ham, Yong-Hyun | - |
dc.contributor.author | Shutov, Dmitriy Alexandrovich | - |
dc.contributor.author | Baek, Kyu-Ha | - |
dc.contributor.author | Do, Lee-Mi | - |
dc.contributor.author | Kim, Kwangsoo | - |
dc.contributor.author | Lee, Chi-Woo | - |
dc.contributor.author | Kwon, Kwang-Ho | - |
dc.date.accessioned | 2021-09-08T00:19:34Z | - |
dc.date.available | 2021-09-08T00:19:34Z | - |
dc.date.created | 2021-06-14 | - |
dc.date.issued | 2010-09-01 | - |
dc.identifier.issn | 0040-6090 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/115706 | - |
dc.description.abstract | In this article, we report the results obtained from a study carried out on the inductively coupled plasma (ICP) etching of poly-monochloro-para-xylylene (parylene-C) thin films using an O-2/CF4 gas mixture. The effects of adding CF4 to the O-2 plasma on the etch rates were investigated. As the CF4 gas fraction increases up to approximately 16%, the polymer etch rate increases in the range of 277-373 nm/min. In this work, the atomic force microscopy (AFM) analysis indicated that the surface roughness was reduced by the addition of CF4 to the O-2 plasma. Contact angle measurements showed that the surface energy decreases with increasing CF4 fraction. At the same time. X-ray photoelectron spectroscopy (XPS) demonstrated the increase in the relative F atomic content on the surface. (C) 2010 Elsevier B.V. All rights reserved. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | ELSEVIER SCIENCE SA | - |
dc.subject | POLYMER DIELECTRIC CHARACTERISTICS | - |
dc.subject | POLYIMIDE | - |
dc.subject | OXYGEN | - |
dc.subject | PERFORMANCE | - |
dc.title | Surface characteristics of parylene-C films in an inductively coupled O-2/CF4 gas plasma | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Lee, Chi-Woo | - |
dc.contributor.affiliatedAuthor | Kwon, Kwang-Ho | - |
dc.identifier.doi | 10.1016/j.tsf.2010.03.138 | - |
dc.identifier.wosid | 000282242600052 | - |
dc.identifier.bibliographicCitation | THIN SOLID FILMS, v.518, no.22, pp.6378 - 6381 | - |
dc.relation.isPartOf | THIN SOLID FILMS | - |
dc.citation.title | THIN SOLID FILMS | - |
dc.citation.volume | 518 | - |
dc.citation.number | 22 | - |
dc.citation.startPage | 6378 | - |
dc.citation.endPage | 6381 | - |
dc.type.rims | ART | - |
dc.type.docType | Article; Proceedings Paper | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Coatings & Films | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.relation.journalWebOfScienceCategory | Physics, Condensed Matter | - |
dc.subject.keywordPlus | POLYMER DIELECTRIC CHARACTERISTICS | - |
dc.subject.keywordPlus | POLYIMIDE | - |
dc.subject.keywordPlus | OXYGEN | - |
dc.subject.keywordPlus | PERFORMANCE | - |
dc.subject.keywordAuthor | Parylene-C | - |
dc.subject.keywordAuthor | O-2/CF4 plasma | - |
dc.subject.keywordAuthor | Surface characteristics | - |
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