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Self-arrangement of solder balls by using the surface wettability difference

Authors
Chang, Jong-hyeonHong, JangwonPak, James Jungho
Issue Date
15-6월-2010
Publisher
ELSEVIER
Keywords
Self-arrangement; Solder balls; Surface wettability
Citation
MATERIALS LETTERS, v.64, no.11, pp.1283 - 1286
Indexed
SCIE
SCOPUS
Journal Title
MATERIALS LETTERS
Volume
64
Number
11
Start Page
1283
End Page
1286
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/116235
DOI
10.1016/j.matlet.2010.03.009
ISSN
0167-577X
Abstract
This letter describes a simple and efficient method of the solder ball placement for electronic packaging. For self-arranging solder balls by using the surface wettability difference, the substrate surface was patterned into the hydrophilic Au solder ball land array with the hydrophobic Teflon passivation layer. Water droplets were formed only on the solder ball lands after dipping the patterned substrate into water. Then, the solder balls were placed on each of the wetted solder ball lands. After soldering two plates with 3 x 3,4 x 4, and 5 x 5 arrayed solder balls, their average shear strengths were as high as 195, 220, and 251 MPa, respectively. (C) 2010 Elsevier B.V. All rights reserved.
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공과대학 (전기전자공학부)
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