Improved Dc Characteristics of AlGaN/GaN HEMTs with Ti/Al/Ti/Ni/Au Electrode Schemes
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Young Su | - |
dc.contributor.author | Choi, Hong Goo | - |
dc.contributor.author | Hahn, Cheol-Koo | - |
dc.contributor.author | Kim, Su Jin | - |
dc.contributor.author | Kim, Tae Geun | - |
dc.date.accessioned | 2021-09-08T04:14:14Z | - |
dc.date.available | 2021-09-08T04:14:14Z | - |
dc.date.created | 2021-06-11 | - |
dc.date.issued | 2010-04 | - |
dc.identifier.issn | 0374-4884 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/116733 | - |
dc.description.abstract | We report on the electrical properties of AlGaN/GaN high-electron-mobility transistors (HEMTs) fabricated with Ti/Al/Ti/Ni/Au multilayer ohmic electrodes on Si substrates. The specific contact resistance of the proposed electrode is as low as 8.8 x 10(-7) Omega cm(2), 5.7 times lower than that of the conventional Ti/Al/Ni/Au electrode. AlGaN/GaN HEMTs with Ti/Al/Ti/Ni/Au ohmic electrodes show a high extrinsic transconductance of 104 mS/mm and a maximum current density of 346 mA/mm, which values are increased by 15.5% and 54%, respectively, as compared to those observed from the AlGaN/GaN HEMTs with Ti/Al/Ni/Au ohmic electrodes. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | KOREAN PHYSICAL SOC | - |
dc.subject | OHMIC CONTACTS | - |
dc.subject | N-GAN | - |
dc.subject | F(MAX) | - |
dc.title | Improved Dc Characteristics of AlGaN/GaN HEMTs with Ti/Al/Ti/Ni/Au Electrode Schemes | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, Tae Geun | - |
dc.identifier.doi | 10.1938/jkps.56.1287 | - |
dc.identifier.scopusid | 2-s2.0-77956388224 | - |
dc.identifier.wosid | 000276783200009 | - |
dc.identifier.bibliographicCitation | JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.56, no.4, pp.1287 - 1290 | - |
dc.relation.isPartOf | JOURNAL OF THE KOREAN PHYSICAL SOCIETY | - |
dc.citation.title | JOURNAL OF THE KOREAN PHYSICAL SOCIETY | - |
dc.citation.volume | 56 | - |
dc.citation.number | 4 | - |
dc.citation.startPage | 1287 | - |
dc.citation.endPage | 1290 | - |
dc.type.rims | ART | - |
dc.type.docType | Article; Proceedings Paper | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.description.journalRegisteredClass | kci | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Physics, Multidisciplinary | - |
dc.subject.keywordPlus | OHMIC CONTACTS | - |
dc.subject.keywordPlus | N-GAN | - |
dc.subject.keywordPlus | F(MAX) | - |
dc.subject.keywordAuthor | Improvement | - |
dc.subject.keywordAuthor | HEMTs | - |
dc.subject.keywordAuthor | Ti/Al/Ti/Ni/Au | - |
dc.subject.keywordAuthor | Ohmic contact | - |
dc.subject.keywordAuthor | DC performance | - |
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