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Scalable growth of free-standing graphene wafers with copper(Cu) catalyst on SiO2/Si substrate: Thermal conductivity of the wafers

Authors
Lee, Yun-HiLee, Jong-Hee
Issue Date
22-2월-2010
Publisher
AMER INST PHYSICS
Keywords
catalysts; chemical vapour deposition; copper; CVD coatings; graphene; metallic thin films; nondestructive testing; Raman spectra; silicon; silicon compounds; thermal conductivity
Citation
APPLIED PHYSICS LETTERS, v.96, no.8
Indexed
SCIE
SCOPUS
Journal Title
APPLIED PHYSICS LETTERS
Volume
96
Number
8
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/116978
DOI
10.1063/1.3324698
ISSN
0003-6951
Abstract
The authors report scalable growth of free-standing graphene wafers with copper(Cu) catalyst on SiO2/Si substrate at low temperature and investigation of their thermal conductivity. The Cu is the most common and the cheapest catalyst among electronic materials. Our process for producing the graphene with the Cu is based on a low-pressure, fast-heating chemical vapor deposition method. Thermal conductivity measurements with nondestructive Raman spectroscopy showed that the free-standing-graphene is a good thermal conductor. The possibility of growing graphene wafer at low temperatures by using a Cu thin film should accelerate research and facilitate the development of graphene for practical applications.
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