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이중 이온주입 공정을 이용한 트렌치 필드링 설계 최적화 및 전기적 특성에 관한 연구

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dc.contributor.author양성민-
dc.contributor.author오주현-
dc.contributor.author배영석-
dc.contributor.author성만영-
dc.date.accessioned2021-09-08T08:05:12Z-
dc.date.available2021-09-08T08:05:12Z-
dc.date.created2021-06-17-
dc.date.issued2010-
dc.identifier.issn1226-7945-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/117921-
dc.description.abstractThe dual ion-implantation trench edge termination techniques were investigated and optimized using a two-dimensional device simulator. By trenching the field ring site which would be dual implanted, a better blocking capability can be obtained. The results show that the p-n junction with dual implanted junction field-ring can accomplish nearly 20% increase of breakdown voltage in comparison with the conventional trench field-rings. The fabrication is relatively difficult. But the trench etched field ring with dual ion-implantation is surpassed for breakdown voltage and consume same area and extensive device simulations as well as qualitative analysis confirm these conclusions.-
dc.languageKorean-
dc.language.isoko-
dc.publisher한국전기전자재료학회-
dc.title이중 이온주입 공정을 이용한 트렌치 필드링 설계 최적화 및 전기적 특성에 관한 연구-
dc.title.alternativeThe Research on Trench Etched Field Ring with Dual Ion-Implantation for Power Devices-
dc.typeArticle-
dc.contributor.affiliatedAuthor성만영-
dc.identifier.bibliographicCitation전기전자재료학회논문지, v.23, no.5, pp.364 - 367-
dc.relation.isPartOf전기전자재료학회논문지-
dc.citation.title전기전자재료학회논문지-
dc.citation.volume23-
dc.citation.number5-
dc.citation.startPage364-
dc.citation.endPage367-
dc.type.rimsART-
dc.identifier.kciidART001443325-
dc.description.journalClass2-
dc.description.journalRegisteredClasskci-
dc.subject.keywordAuthorPower device-
dc.subject.keywordAuthorEdge termination-
dc.subject.keywordAuthorTrench field ring-
dc.subject.keywordAuthorDual ion-implantation-
dc.subject.keywordAuthorPower device-
dc.subject.keywordAuthorEdge termination-
dc.subject.keywordAuthorTrench field ring-
dc.subject.keywordAuthorDual ion-implantation-
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