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Direct comparison of the electrical properties in metal/oxide/nitride/oxide/silicon and metal/aluminum oxide/nitride/oxide/silicon capacitors with equivalent oxide thicknesses

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dc.contributor.authorAn, Ho-Myoung-
dc.contributor.authorSeo, Yu Jeong-
dc.contributor.authorKim, Hee Dong-
dc.contributor.authorKim, Kyoung Chan-
dc.contributor.authorKim, Jong-Guk-
dc.contributor.authorCho, Won-Ju-
dc.contributor.authorKoh, Jung-Hyuk-
dc.contributor.authorSung, Yun Mo-
dc.contributor.authorKim, Tae Geun-
dc.date.accessioned2021-09-08T15:25:05Z-
dc.date.available2021-09-08T15:25:05Z-
dc.date.created2021-06-10-
dc.date.issued2009-07-31-
dc.identifier.issn0040-6090-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/119645-
dc.description.abstractWe examine the electrical properties of metal/oxide/nitride/oxide/silicon (MONOS) capacitors with two different blocking oxides, SiO2 and Al2O3, under the influence of the same electric field. The thickness of the Al2O3 layer is set to 150 angstrom, which is electrically equivalent to a thickness of the SiO2 layer of 65 angstrom, in the MONOS structure for this purpose. The capacitor with the Al2O3 blocking layer shows a larger capacitance-voltage memory window of 8.6 V, lower program voltage of 7 V, faster program/erase speeds of 10 ms/1 mu s, lower leakage current of 100 pA and longer data retention than the one with the SiO2 blocking layer does. These improvements are attributed to the suppression of the carrier transport to the gate electrode afforded by the use of an Al2O3 blocking layer physically thicker than the SiO2 one, as well as the effective charge-trapping by Al2O3 at the deep energy levels in the nitride layer. (C) 2009 Elsevier B.V. All rights reserved.-
dc.languageEnglish-
dc.language.isoen-
dc.publisherELSEVIER SCIENCE SA-
dc.subjectNONVOLATILE MEMORY DEVICES-
dc.subjectSONOS MEMORY-
dc.subjectSILICON-
dc.subjectISSUES-
dc.subjectSPEED-
dc.subjectAL2O3-
dc.subjectLAYER-
dc.titleDirect comparison of the electrical properties in metal/oxide/nitride/oxide/silicon and metal/aluminum oxide/nitride/oxide/silicon capacitors with equivalent oxide thicknesses-
dc.typeArticle-
dc.contributor.affiliatedAuthorKim, Jong-Guk-
dc.contributor.affiliatedAuthorSung, Yun Mo-
dc.contributor.affiliatedAuthorKim, Tae Geun-
dc.identifier.doi10.1016/j.tsf.2009.03.184-
dc.identifier.scopusid2-s2.0-65649083774-
dc.identifier.wosid000267182700037-
dc.identifier.bibliographicCitationTHIN SOLID FILMS, v.517, no.18, pp.5589 - 5592-
dc.relation.isPartOfTHIN SOLID FILMS-
dc.citation.titleTHIN SOLID FILMS-
dc.citation.volume517-
dc.citation.number18-
dc.citation.startPage5589-
dc.citation.endPage5592-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMaterials Science, Coatings & Films-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.relation.journalWebOfScienceCategoryPhysics, Condensed Matter-
dc.subject.keywordPlusNONVOLATILE MEMORY DEVICES-
dc.subject.keywordPlusSONOS MEMORY-
dc.subject.keywordPlusSILICON-
dc.subject.keywordPlusISSUES-
dc.subject.keywordPlusSPEED-
dc.subject.keywordPlusAL2O3-
dc.subject.keywordPlusLAYER-
dc.subject.keywordAuthorSONOS-
dc.subject.keywordAuthorSANOS-
dc.subject.keywordAuthorAluminum oxide-
dc.subject.keywordAuthorHigh-k dielectrics-
dc.subject.keywordAuthorFlash memory-
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