Decomposition of Cu6Sn5 particles in solder for the growth of a ternary (Cu1-xNix)(6)Sn-5 layer on a Ni substrate
- Authors
- Chung, Bo-Mook; Hong, Kyoung-Kook; Huh, Joo-Youl
- Issue Date
- 6월-2009
- Publisher
- KOREAN INST METALS MATERIALS
- Keywords
- Cu/Sn/Ni diffusion couple; cross-interaction; ternary intermetallic compounds; decomposition; lead-free solder
- Citation
- METALS AND MATERIALS INTERNATIONAL, v.15, no.3, pp.487 - 492
- Indexed
- SCIE
SCOPUS
KCI
- Journal Title
- METALS AND MATERIALS INTERNATIONAL
- Volume
- 15
- Number
- 3
- Start Page
- 487
- End Page
- 492
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/119975
- DOI
- 10.1007/s12540-009-0487-8
- ISSN
- 1598-9623
- Abstract
- The interaction between Cu6Sn5 particles in the bulk of a solder and a Ni substrate was examined during solid-state aging using Cu/Sn/Ni and Cu/Sn/Cu/Sn/Ni diffusion couples with initially thin Cu layers. The results clearly demonstrated that the (Cu,Ni)(6)Sn-5 particles dispersed in the bulk solder decomposed in order for a ternary (Cu1-xNix)(6)Sn-5 layer to grow at the solder/Ni interface during solid-state aging. The interaction between the (Cu,Ni)(6)Sn-5 particles and the (Cu1-xNix)(6)Sn-5 layer occurs owing to the driving force for the (Cu,Ni)(6)Sn-5 compound to become saturated with Ni. A (Ni,Cu)(3)Sn-4 layer forms at the (Cu1-xNix)(6)Sn-5/Ni interface only after the Ni composition of the (Cu,Ni)(6)Sn-5 phase in the bulk solder approaches that of the (Cu1-xNix)(6)Sn-5 layer. Once the (Ni,Cu)(3)Sn-4 layer has formed, it grows at an exceptionally rapid rate by consuming the (Cu1-xNix)(6)Sn-5 and Sn layers, which can be problematic in solder joint reliability.
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Collections - College of Engineering > Department of Materials Science and Engineering > 1. Journal Articles
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