The effect of electrode heat sink in organic-electronic devices
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Choi, Sang Hun | - |
dc.contributor.author | Lee, Tae Il | - |
dc.contributor.author | Baik, Hong Koo | - |
dc.contributor.author | Roh, Hee Hwan | - |
dc.contributor.author | Kwon, Ohmyoung | - |
dc.contributor.author | Suh, Dong hak | - |
dc.date.accessioned | 2021-09-09T02:49:24Z | - |
dc.date.available | 2021-09-09T02:49:24Z | - |
dc.date.created | 2021-06-10 | - |
dc.date.issued | 2008-11-03 | - |
dc.identifier.issn | 0003-6951 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/122420 | - |
dc.description.abstract | Most of organic devices showed poor thermal stability and short lifetime due to Joule heating by current injection during operation. To increase the lifetime of the devices, thermal management must be considered. We demonstrated the polymer light-emitting diodes with thermally conductive substrate and Al/Cu double cathode to enhance the thermal stability of the device. Also, we proposed the correlation between lifetime (Delta t) and device heat sink (Delta T). The heat sink of all organic devices is required to enhance device durability. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | AMER INST PHYSICS | - |
dc.subject | LIGHT-EMITTING-DIODES | - |
dc.subject | SCANNING THERMAL MICROSCOPE | - |
dc.subject | ELECTROLUMINESCENT DEVICES | - |
dc.subject | SOFTENING TEMPERATURE | - |
dc.subject | LAYERS | - |
dc.title | The effect of electrode heat sink in organic-electronic devices | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kwon, Ohmyoung | - |
dc.identifier.doi | 10.1063/1.3021071 | - |
dc.identifier.scopusid | 2-s2.0-55849090683 | - |
dc.identifier.wosid | 000260778100078 | - |
dc.identifier.bibliographicCitation | APPLIED PHYSICS LETTERS, v.93, no.18 | - |
dc.relation.isPartOf | APPLIED PHYSICS LETTERS | - |
dc.citation.title | APPLIED PHYSICS LETTERS | - |
dc.citation.volume | 93 | - |
dc.citation.number | 18 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | LIGHT-EMITTING-DIODES | - |
dc.subject.keywordPlus | SCANNING THERMAL MICROSCOPE | - |
dc.subject.keywordPlus | ELECTROLUMINESCENT DEVICES | - |
dc.subject.keywordPlus | SOFTENING TEMPERATURE | - |
dc.subject.keywordPlus | LAYERS | - |
dc.subject.keywordAuthor | aluminium | - |
dc.subject.keywordAuthor | charge injection | - |
dc.subject.keywordAuthor | copper | - |
dc.subject.keywordAuthor | electrodes | - |
dc.subject.keywordAuthor | heat sinks | - |
dc.subject.keywordAuthor | organic light emitting diodes | - |
dc.subject.keywordAuthor | polymers | - |
dc.subject.keywordAuthor | thermal stability | - |
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