Quality factor measurement of micro gyroscope structure according to vacuum level and desired Q-factor range package method
DC Field | Value | Language |
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dc.contributor.author | Kim, Jong-Seok | - |
dc.contributor.author | Lee, Sang-Woo | - |
dc.contributor.author | Jung, Kyu-Dong | - |
dc.contributor.author | Kim, Woon-Bae | - |
dc.contributor.author | Choa, Sung-Hoon | - |
dc.contributor.author | Ju, Byeong-Kwon | - |
dc.date.accessioned | 2021-09-09T07:47:57Z | - |
dc.date.available | 2021-09-09T07:47:57Z | - |
dc.date.created | 2021-06-10 | - |
dc.date.issued | 2008-06 | - |
dc.identifier.issn | 0026-2714 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/123436 | - |
dc.description.abstract | A micro-machined gyro chip of gyroscope is normally packaged in specific vacuum level to get the specific quality factor(Q-factor). if the Q-factor is too high, frequency tuning and the approximate matching between driving and sensing comb structure become difficult, and if the Q-factor is too low, its sensitivity decreases. The optimum Q-factor of our gyro chip design is 4000 range. To get this range, we measured the drive mode Q-factor as vacuum level of our gyro chip and we found that the vacuum level of the desired Q-factor 4000 is in the range of 740 mTorr. Based on this data, we fabricate the wafer level package gyro chip of the desired Q-factor by controlled the basic pressure of package bonding chamber just prior to the bonding process. After wafer level package process, we measured Q-factor of whole samples. Among 804 samples, 502 packaged gyro chips are worked and the Q-factor of 67% samples is between 3500 and 4500 range. (c) 2008 Elsevier Ltd. All rights reserved. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | - |
dc.title | Quality factor measurement of micro gyroscope structure according to vacuum level and desired Q-factor range package method | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Ju, Byeong-Kwon | - |
dc.identifier.doi | 10.1016/j.microrel.2008.03.001 | - |
dc.identifier.scopusid | 2-s2.0-45849146963 | - |
dc.identifier.wosid | 000258049700024 | - |
dc.identifier.bibliographicCitation | MICROELECTRONICS RELIABILITY, v.48, no.6, pp.948 - 952 | - |
dc.relation.isPartOf | MICROELECTRONICS RELIABILITY | - |
dc.citation.title | MICROELECTRONICS RELIABILITY | - |
dc.citation.volume | 48 | - |
dc.citation.number | 6 | - |
dc.citation.startPage | 948 | - |
dc.citation.endPage | 952 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordAuthor | RF-MEMS | - |
dc.subject.keywordAuthor | Gyroscope | - |
dc.subject.keywordAuthor | Quality factor | - |
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