Quality factor measurement of micro gyroscope structure according to vacuum level and desired Q-factor range package method
- Authors
- Kim, Jong-Seok; Lee, Sang-Woo; Jung, Kyu-Dong; Kim, Woon-Bae; Choa, Sung-Hoon; Ju, Byeong-Kwon
- Issue Date
- 6월-2008
- Publisher
- PERGAMON-ELSEVIER SCIENCE LTD
- Keywords
- RF-MEMS; Gyroscope; Quality factor
- Citation
- MICROELECTRONICS RELIABILITY, v.48, no.6, pp.948 - 952
- Indexed
- SCIE
SCOPUS
- Journal Title
- MICROELECTRONICS RELIABILITY
- Volume
- 48
- Number
- 6
- Start Page
- 948
- End Page
- 952
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/123436
- DOI
- 10.1016/j.microrel.2008.03.001
- ISSN
- 0026-2714
- Abstract
- A micro-machined gyro chip of gyroscope is normally packaged in specific vacuum level to get the specific quality factor(Q-factor). if the Q-factor is too high, frequency tuning and the approximate matching between driving and sensing comb structure become difficult, and if the Q-factor is too low, its sensitivity decreases. The optimum Q-factor of our gyro chip design is 4000 range. To get this range, we measured the drive mode Q-factor as vacuum level of our gyro chip and we found that the vacuum level of the desired Q-factor 4000 is in the range of 740 mTorr. Based on this data, we fabricate the wafer level package gyro chip of the desired Q-factor by controlled the basic pressure of package bonding chamber just prior to the bonding process. After wafer level package process, we measured Q-factor of whole samples. Among 804 samples, 502 packaged gyro chips are worked and the Q-factor of 67% samples is between 3500 and 4500 range. (c) 2008 Elsevier Ltd. All rights reserved.
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